Dell PowerEdge T110 User Manual

88 Installing System Components
CAUTION: Be careful not to bend any of the pins on the ZIF socket when removing
the processor. Bending the pins can permanently damage the system board.
12 Carefully, lift the processor out of the socket and leave the release lever up
so that the socket is ready for the new processor.
Installing a Processor
1 Unpack the new processor.
2 Align the p rocessor with the socket keys on t he ZIF socket. See
Figure 3-16.
CAUTION: Positioning the processor incorrectly can permanently damage the
system board or the processor. Be careful not to bend the pins in the socket.
3 With the release lever on the processor socket in the open position, a lign
the
p rocessor with the socket keys and set the processor lightly in the
socket.
CAUTION: Do not use force to seat the processor. When the processor is
positioned correctly, it engages easily into the socket.
4 Close the processor shield.
5 R otate the socket release lever down until it snaps into place.
6
Using a clean lint-free cloth, remove the thermal grease from the heat sink.
7 Open the grease packet included with your processor kit and apply thermal
grease evenly to the top of the new processor.
8 Place the heat sink on the processor. See Figure 3-16 .
9 Using a #2 Phillips screwdriver, tighten the heat-sink retention screws.
See
Figure 3-15 .
10
Replace the cooling shroud. See "Installing the Cooling Shroud" on
page 74.
11 Replace the expansion card stabilizer. See "Installing the Expansion Card
Stabilizer" on page 72.
12 Close the system. See "Closing the System" on page 58.
13 Reconnect the system and peripherals to their power sources, and turn
them on.
Mayzie_HOM.book Page 88 Monday, August 31, 2009 9:33 PM

Dell PowerEdge T110 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLD
Processor cache	8 MB
Processor cores	4
Processor model	X3450
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor threads	8
Processor codename	Lynnfield
Processing Die size	296 mm²
Processor frequency	2.66 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	20
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
Hot-swap	-
HDD capacity	500 GB
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Number of HDDs installed	2
Internal memory	4 GB
Memory clock speed	1066 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Graphics card	G200eW
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Power supply	305 W
Compatible operating systems	Microsoft SQL Server 2008 R2, Microsoft Windows Small Business Server 2008, Microsoft Windows Essential Business Server 2008, Microsoft Windows Server 2008 Foundation R2, Microsoft Windows Server 2008 SP2, x86/x64 (x64 Hyper-VTM), Microsoft Windows Server 2008 R2, x64 (Hyper-VTM v2), Microsoft Windows HPC Server 2008, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux
Chassis type	Tower
Processor ARK ID	42929
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	463.8 mm
Width	188.64 mm
Height	418.55 mm