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Dell PowerEdge T110 User Manual

Dell PowerEdge T110
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Running the System Diagnostics 123
Using the Custom Test Options
When you select Custom Test in the Main Menu window, the Customize
window allows you to select the device(s) to be tested, select specific options
for testing, and view the test results.
Selecting Devices for Testing
The left side of the Customize window lists devices that can be tested. Click
(+) next to a device or module to view its components. Click (+) on any
component to view the tests that are available. Clicking a device, rather than
its components, selects all of the components of the device for testing.
NOTE: After you select all the devices and components that you want to test,
highlight All Devices and then click Run Tests.
Selecting Diagnostics Options
From the Diagnostics Options area, select the test(s) you want to run on a
device. You can select:
Non-Interactive Tests Only
— Runs only tests that require no user
intervention.
Quick Tests Only
— Runs only the quick tests on the device.
Show Ending Timestamp
— Time stamps the test log.
Test Iterations
— Selects the number of times the test is run.
Log output file pathname
— Enables you to specify the USB memory key
where the test log file is saved. You cannot save the file to a hard drive.
Mayzie_HOM.book Page 123 Monday, August 31, 2009 9:33 PM

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Dell PowerEdge T110 Specifications

General IconGeneral
Tcase72.7 °C
Bus typeDMI
SteppingB1
FSB ParityNo
Processor codeSLBLD
Processor cache8 MB
Processor cores4
Processor modelX3450
System bus rate2.5 GT/s
Processor seriesIntel Xeon 3400 Series
Processor socketLGA 1156 (Socket H)
Processor threads8
Processor codenameLynnfield
Processing Die size296 mm²
Processor frequency2.66 GHz
Processor cache typeSmart Cache
Processor lithography45 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus- MHz
Processor boost frequency3.2 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8, 4x4
Supported instruction setsSSE4.2
Thermal Design Power (TDP)95 W
Number of processors installed1
CPU multiplier (bus/core ratio)20
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM
Number of Processing Die Transistors774 M
Memory channels supported by processorDual
Memory clock speeds supported by processor800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Maximum internal memory supported by processor32 GB
HDD size3.5 \
Hot-swap-
HDD capacity500 GB
HDD interfaceSerial ATA
Optical drive typeDVD-ROM
Total storage capacity1000 GB
Maximum storage capacity- TB
Number of HDDs installed2
Internal memory4 GB
Memory clock speed1066 MHz
Maximum internal memory16 GB
Memory layout (slots x size)2 x 2 GB
Graphics cardG200eW
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version2.0
Power supply305 W
Compatible operating systemsMicrosoft SQL Server 2008 R2, Microsoft Windows Small Business Server 2008, Microsoft Windows Essential Business Server 2008, Microsoft Windows Server 2008 Foundation R2, Microsoft Windows Server 2008 SP2, x86/x64 (x64 Hyper-VTM), Microsoft Windows Server 2008 R2, x64 (Hyper-VTM v2), Microsoft Windows HPC Server 2008, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux
Chassis typeTower
Processor ARK ID42929
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth463.8 mm
Width188.64 mm
Height418.55 mm

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