Dell PowerEdge T110 User Manual

132 Glossary
CPU — Central processing unit. See processor.
DC — Direct current.
DDR — Double-data rate. A technology in memory modules that potentially doubles
the data rate by transferring data on both the rising and falling pulses of a clock cycle.
device driver — A program that allows the operating system or some other program to
interface correctly with a peripheral.
DHCP — Dynamic Host Configuration Protocol. A method of automatically
assigning an IP address to a client system.
diagnostics — A comprehensive set of tests for your system.
DIMM — Dual in-line memory module. See also memory module.
DNS — Domain Name System. A method of translating Internet domain names, such
as www.example.com, into IP addresses, such as 208.77.188.166.
DRAM — Dynamic random-access memory. A system’s RAM is usually made up
entirely of DRAM chips.
driver — See device driver.
DVD — Digital versatile disc or digital video disc.
ECC — Error checking and correction.
EMI — Electromagnetic interference.
ERA — Embedded remote access. ERA allows you to perform remote, or "out-of-
band," server management on your network server using a remote access controller.
ESD — Electrostatic discharge.
ESM — Embedded server management.
expansion bus — Your system contains an expansion bus that allows the processor to
communicate with controllers for peripherals, such as NICs.
expansion card — An add-in card, such as a NIC or SCSI adapter, that plugs into an
expansion-card connector on the system board. An expansion card adds some
specialized function to the system by providing an interface between the expansion
bus and a peripheral.
expansion-card connector — A connector on the system board or riser board for
plugging in an expansion card.
F — Fahrenheit.
FAT — File allocation table. The file system structure used by MS-DOS
®
to organize
and keep track of file storage. The Microsoft
®
Windows
®
operating systems can
optionally use a FAT file system structure.
Fibre Channel — A high-speed network interface used primarily with networked
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Dell PowerEdge T110 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLD
Processor cache	8 MB
Processor cores	4
Processor model	X3450
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor threads	8
Processor codename	Lynnfield
Processing Die size	296 mm²
Processor frequency	2.66 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	20
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
Hot-swap	-
HDD capacity	500 GB
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Number of HDDs installed	2
Internal memory	4 GB
Memory clock speed	1066 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Graphics card	G200eW
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Power supply	305 W
Compatible operating systems	Microsoft SQL Server 2008 R2, Microsoft Windows Small Business Server 2008, Microsoft Windows Essential Business Server 2008, Microsoft Windows Server 2008 Foundation R2, Microsoft Windows Server 2008 SP2, x86/x64 (x64 Hyper-VTM), Microsoft Windows Server 2008 R2, x64 (Hyper-VTM v2), Microsoft Windows HPC Server 2008, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux
Chassis type	Tower
Processor ARK ID	42929
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	463.8 mm
Width	188.64 mm
Height	418.55 mm