LPWA Module Series
BG95&BG96 Compatible Design
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Figure 23: Recommended Footprint of BG95/BG96 (Top View)
5.2. Recommended Stencil Design
In order to ensure the module soldering quality, the thickness of stencil is recommended to be 0.13mm to
0.15mm for BG95 and BG96. For more details, please refer to document [5].