LPWA Module Series
BG95&BG96 Compatible Design
BG95&BG96_Compatible_Design 41 / 47
6 Manufacturing and Packaging
6.1. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass.
It is suggested that the peak reflow temperature is 238ºC ~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C )
Reflow Zone
Soak Zone
245
200
220
238
C
D
B
A
150
100
Cooling down
slope: 1~4°C /sec
Figure 25: Reflow Soldering Thermal Profile
To Next Page
Loading...
Need help?
General
