Smart Module Series
SC200R&SC262R_Series_Hardware_Design 20 / 124
SC200R is a series of SMD type modules, which can be embedded into applications through its 274 pins,
including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm × 40.5 mm × 2.8 mm, the
module can meet almost all requirements for M2M applications such as edge device, edge computing,
CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm
panel, security and industry PDA, etc.
2.2. Key Features
The following table describes the detailed features of SC200R series module.
Table 7: Key Features
⚫ 64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz
⚫ 512 KB L2 cache
⚫ Hexagon DSP v56 core, up to 691 MHz
⚫ 768 KB L2 cache
Adreno
TM
308 GPU with 64-bit addressing, up to 485 MHz
⚫ 8 GB eMMC + 1 GB LPDDR3 (default)
⚫ 16 GB eMMC + 2 GB LPDDR3 (optional)
⚫ Supply voltage: 3.55–4.2 V
⚫ Typical supply voltage: 3.8 V
⚫ Class 4 (33 dBm ±2 dB) for GSM850
⚫ Class 4 (33 dBm ±2 dB) for EGSM900
⚫ Class 1 (30 dBm ±2 dB) for DCS1800
⚫ Class 1 (30 dBm ±2 dB) for PCS1900
⚫ Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
⚫ Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
⚫ Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
⚫ Class 3 (24 dBm +1/-3 dB) for WCDMA bands
⚫ Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0
⚫ Class 3 (23 dBm ±2 dB) for LTE-FDD bands
⚫ Class 3 (23 dBm ±2 dB) for LTE-TDD bands
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