Tip unsoldering procedure.
Use small solder-wick to remove
the solder and wire from the tip
ground via. Size #1 Solder-Wick
is recommended due to the small
size of the tip and vias. Do not
place the solder wick over the
0201 input resistors and these
parts may accidentally be
unsoldered from the board.
Use the solder-wick to remove
excess solder from the input vias.
Again, be careful not to place the
solder-wick too close to the input
resistors.
If the solder cannot be fully
removed from the input via while
attached to the test points, it is
possible rock the tip side to side
while reflowing the solder in the
vias. Since the wires are cut flush
to the board, the tip can be slowly
removed from the wires using
this method. Once the tip has
been removed from the board,
use the solderwick to clean out
the vias so the tip can be reused.
If you used double-sided foam
tape for strain relief rocking and
moving the tip from side to side
will loosen the tape's adhesion to
the tip. Do not try to pull the tip
directly off of the tape. Pulling the
Basic operation
P7700 Series TriMode™ Probes 33
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