NEO-8Q / NEO-M8 - Hardware Integration Manual
UBX-15029985 - R04 Production Information Product handling
Page 22 of 31
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer’s own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox makes no warranty for damages to the modules caused by soldering metal cables or any other forms
of metal strips directly onto the EMI covers.
Use of ultrasonic processes
Some components on the modules are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes (cleaning,
welding etc.) may cause damage to the GNSS Receiver.
u-blox offers no warranty against damages to the modules caused by any Ultrasonic Processes.
4.3 EOS/ESD/EMI precautions
When integrating GNSS positioning modules into wireless systems, careful consideration must be given to
electromagnetic and voltage susceptibility issues. Wireless systems include components that can produce
Electrical Overstress (EOS) and Electro-Magnetic Interference (EMI). CMOS devices are more sensitive to such
influences because their failure mechanism is defined by the applied voltage, whereas bipolar semiconductors
are more susceptible to thermal overstress. The following design guidelines are provided to help in designing
robust yet cost effective solutions.
To avoid overstress damage during production or in the field it is essential to observe strict
EOS/ESD/EMI handling and protection measures.
To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see the corresponding product data sheet in the Related documents).
To Next Page
Loading...
Need help?
General
