Power consumption Section 6 Wiring
88 M&I – AC 900F Controller
• Install sufficiently dimensioned equipotential bonding lines if high potential
differences between the system components are present or expected to occur
with your specific application.
• The impedance of the equipotential bonding line should amount to maximum
10% of the shield impedance of shielded signal lines between the same points.
• The cross-section of the equipotential bonding line must be rated for the
maximum compensating current. Experience has shown that a cross-section of
16 mm² is usually sufficient.
• Equipotential bonding and shielded signal cables should be laid as close as
possible to each other to prevent the formation of inductive loops and the risk
of interference coupling.
• Ensure low-impedance connection between equipotential bonding lines and
PE.
Power consumption
The total power consumption of the controller corresponds to the sum of all
individual consumption values. The following values must be taken into
consideration:
• the power consumption of the CPU module through the L+ and M terminals.
After voltage conversion within the CPU module, the communication
interfaces and the bus-connected I/O modules are supplied from here as well.
• the power consumption for the process supply voltage at the ZP and UP
terminals of the terminal blocks. The power for the consumers at the
digital/analog outputs and the electronics inside the I/O module is also supplied
from here.
8 Switch cabinet earthing
9 Equipotential bonding line between the switch cabinets, if applicable, at
least 16 mm
2
10 Cable shield earthing
*) The use of a common power supply unit is also possible.
Item No. Description
To Next Page
Loading...
Need help?
General
