Dell PowerEdge T710 Technical Guide

Dell
PowerEdge T710 Technical Guide 29
7.3.1 RDIMMS
The advantages of using RDIMMs include:
 Higher RAS capabilities
 Best for memory intensive applications
 More scalable
 Higher capacity
FBDIMMs are closer to RDIMMs since they both use some sort of buffer.
RDIMMs are recommended when the following are needed:
 Large amount of memory
 High RAS features
 Better future expansion
Key benefits of RDIMMS:
 Gain a slight performance advantage if the memory is being heavily utilized (for example:
>=70%). The 70% utilization is based upon the RDIMM maximum and a 75% read rate.
 Allow for larger capacities, up to 16 GB.
 Allow for more expansion since they can go to 3 DPC (DIMMs per channel) instead of 2 DPC.
 Have address parity, a new RAS feature that halts the system if an incorrect address is
detected.
7.3.2 UDIMMs
UDIMMS are typically more cost effective and are lower power. UDIMMS have limited scalability up to
24 GB.
UDIMMs are recommended when the following are needed:
 Limited amount of memory (up to 24 GB)
 Lower cost
 Power savings
Key attributes of UDIMMS:
 UDIMMs are generally cheaper
 Use less power, saving about 1 Watt per DIMM
 Maximum size of 2 GB
 Limited to 2 DPC (only an issue in 18 slot systems)
 No support for address parity
7.4 Memory Modes
The memory mode is dependent on how the memory is populated in the system.
 Three channels populated per processor:
o Typically, the system runs in Independent Channel mode in this configuration. This
mode offers the most DIMM population flexibility and system memory capacity, but
offers the least number of RAS (reliability, availability, service) features.
o All three channels must be populated identically.
o Maximum memory bus speed is 800 MT/s.
 Two channels (CH 2 and CH 1) are populated identically per CPU; the third channel is unused:
o When mirroring is enabled, the memory image in Channel 2 is maintained the same as
Channel 1.

Dell PowerEdge T710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF8
Processor cache	4 MB
Processor cores	4
Processor model	E5506
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD speed	15000 RPM
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	300 GB
Maximum storage capacity	- TB
Number of HDDs supported	6
Graphics card	G200
Graphics card family	Matrox
Memory slots	18x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	2 x 2 GB
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	8
PCI Express x8 slots	5
Power supply	1100 W
Number of power supply units	-
Compatible operating systems	Windows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificates	ENERGY STAR
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis type	Tower (5U)
Processor ARK ID	37096

Weight and Dimensions

Depth	731.8 mm
Width	217.9 mm
Height	466.3 mm
Weight	35300 g