Dell PowerEdge T710 Technical Guide

Dell
PowerEdge T710 Technical Guide 33
8 Chipset
8.1 Overview
The Dell™ PowerEdge™ T710 planar incorporates the Intel
®
Xeon
®
5520 processor series chipset for
I/O and processor interfacing. This chipset is designed to support the Intel Xeon 5500 and 5600
processor series family, QuickPath Interconnect, DDR3 memory technology, and PCI Express
Generation 2. The chipset consists of the Intel 5520 chipset I/O Hub (IOH) and ICH9.
8.2 Intel Dual I/O Hub (IOH)
The T710 motherboard incorporates the Intel 5520 chipset IOH to provide a link between the Intel
Xeon processor(s) 5500 and 5600 series and I/O components. The main components of the IOH consist
of two full-width QPI links (one to each processor), 72 lanes of PCIe Gen2, and a x4 ESI link to
connect directly to the South Bridge.
The IOH supports a special mode to work with DP processors that allows two IOHs to appear as a
single IOH to the processors in the system. This mode results in special behavior in the link and
protocol layers. Each IOH will have a unique NodeID for communication between each other, but only
the legacy IOH‘s NodeID will be exposed to the processor.
8.3 Intel Quickpath Architecture (QPI)
The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the
IOH. The T710 has a total of four QuickPath Interconnect (QPI) links including one link connecting the
processors and links connecting both processors with the IOH and links connecting both IOHs. Each
link consists of 20 lanes (full-width) in each direction with a link speed of 6.4 GT/s. An additional
lane is reserved for a forwarded clock. Data is sent over the QPI links as packets.
The QuickPath Architecture implemented in the IOH and processors features four layers:
 Physical layer—Consists of the actual connection between components. Supports Polarity
Inversion and Lane Reversal for optimizing component placement and routing.
 Link layer—Responsible for flow control and the reliable transmission of data.
 Routing layer—Responsible for the routing of QPI data packets.
 Protocol layer—Responsible for high-level protocol communications, including the
implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence
protocol.
8.4 PCI Express Generation 2
PCI Express is a serial point-to-point interconnects for I/O devices. PCIe Gen2 doubles the signaling
bit rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible
with Gen1 transfer rates.
8.5 Intel Direct Media Interface (DMI)
The DMI previously called the Enterprise Southbridge Interface) connects the IOH with the Intel I/O
Controller Hub (ICH). The DMI is equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 GB/s in
each direction.
8.6 Intel I/O Controller Hub 9 (ICH9)
ICH9 is a highly integrated I/O controller, supporting the following functions:

Dell PowerEdge T710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF8
Processor cache	4 MB
Processor cores	4
Processor model	E5506
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD speed	15000 RPM
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	300 GB
Maximum storage capacity	- TB
Number of HDDs supported	6
Graphics card	G200
Graphics card family	Matrox
Memory slots	18x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	2 x 2 GB
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	8
PCI Express x8 slots	5
Power supply	1100 W
Number of power supply units	-
Compatible operating systems	Windows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificates	ENERGY STAR
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis type	Tower (5U)
Processor ARK ID	37096

Weight and Dimensions

Depth	731.8 mm
Width	217.9 mm
Height	466.3 mm
Weight	35300 g