Dell PowerEdge T710 Technical Guide

Dell
PowerEdge T710 Technical Guide 30
o Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by
having the cache line split across both channels. This mode provides improved RAS
features (SDDC support for x8-based memory).
o For memory mirroring, the two channels operate as mirrors of each other—writes go to
both channels and reads alternate between the two channels. The channels are no
longer in lockstep mode.
 One channel populated per CPU:
o This is a simple Memory Optimized (Independent) mode. Mirroring is not supported.
The T710 memory interface supports memory demand and patrol scrubbing, single-bit correction and
multi-bit error detection. Correction of a x4 or x8 device failure is also possible through the lockstep
channel mode and the SDDC code. Additionally, correction of a x4 device failure is possible through
the independent channel mode.
7.5 Memory Population
Across processor sockets, DIMM populations can be different as long as the population rules for each
socket are followed. Additionally, both processor sockets operate in the same RAS mode and are set
up with the same memory timing parameters.
The following memory population rules apply:
 If DIMMs of different speeds are mixed, all channels operate at the fastest common
frequency.
 RDIMMs and UDIMMs cannot be mixed.
 The first DIMM slot in each channel is color-coded with white ejection tabs for ease of
identification.
 The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center, in order to provide
enough space for sufficient airflow to cool stacked DIMMs.
 The T710 memory subsystem supports up to 18 DIMMs. DIMMs must be installed in each
channel starting with the DIMM farthest from the processor. Population order is identified by
the silkscreen designator and the System Information Label (SIL) located on the chassis cover.
See Figure 7 for DIMM naming and numbering.
CH1CH2CH3 CH1 CH2 CH3
Memory Channel Organization Figure 7.
For more information on memory population requirements, see the System Memory section in the
Installing System Components chapter of the Dell PowerEdge T710 Systems Hardware Owner’s
Manual on Support.Dell.com.

Dell PowerEdge T710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF8
Processor cache	4 MB
Processor cores	4
Processor model	E5506
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD speed	15000 RPM
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	300 GB
Maximum storage capacity	- TB
Number of HDDs supported	6
Graphics card	G200
Graphics card family	Matrox
Memory slots	18x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	2 x 2 GB
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	8
PCI Express x8 slots	5
Power supply	1100 W
Number of power supply units	-
Compatible operating systems	Windows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificates	ENERGY STAR
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis type	Tower (5U)
Processor ARK ID	37096

Weight and Dimensions

Depth	731.8 mm
Width	217.9 mm
Height	466.3 mm
Weight	35300 g