3. TECHNICAL BRIEF
3.11 External memory interface
3.11.1 Introduction
Since LGP970 contains communication and application processor, memory is dedicated only for each processor.
XMM6160 (IFX modem) uses MCP (Multi Chip Package) 1Gb nand / 512Mb LPDDR1 and AP20 uses POP (Package
on Package) 512MB LPDDR1 and 2GB eMMC nand memory.
3.11.2 LGP970 XMM6160 (IFX Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
-512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
NAND 1.8V
45ns H8BCS0QG0MMR-
46M
SDRAM
Hynix
1.8V 166MHz
3.11.3 LGP970 OMAP3630 memory Interface
- Package on Package on OMAP3630: LPDDR1 512MB SDRAM
- 8GB eMMC 4.4 version
LPDDR1 SDRAM
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
H8MBX00U0MER-0EM
SDRAM Hynix
1.8V/1.2/1.2/1.2
DDR1 400
(200MHz)
8GB NAND
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
SDIN5D2-2G NAND Sandisk 3.3V
15MB/s for read
9MB/s for write
3.11.4. External SD card memory Interface
TI OMAP3630 supports external SD card which supports up to 32GB (SDHC compatible)
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