• Core supply generation
• Charge control circuitry
• Level shifter and regulator for USB/FBUS
• Current gauge for battery current measuring
• LED driver for backlights
• Digital interface (CBUS)
Device memories
RAP memories NOR flash and SDRAM
Modem memory consists of 128 Mbit SDRAM and 128 Mbit NOR flash memories.
Combo memory
The application memory of the device consists of NAND/DDR combo memory. The stacked DDR/NAND
application memory has 512 Mbit of DDR memory and 1024 Mbit of flash memory. The DDR DRAM memory is
stacked above the NAND flash.
Audio concept
Audio HW architecture
The functional core of the audio hardware is built around two ASICs: RAP CMT engine ASIC and the mixed-
signal EM ASIC N2200.
There are three audio transducers:
• 7mm x 11mm dynamic earpiece
• 16mm dynamic speaker
• electret microphone module
In addition to the audio transducers, N2200 also provides an output for the dynamic vibra component.
All galvanic audio accessories are connected to the system connector accessory connector.
A Bluetooth audio module that is connected to RAP supports Bluetooth audio functionality.
There is a separate application processor for Symbian applications.
RM-91; RM-92
System Module Nokia Customer Care
Issue 1 COMPANY CONFIDENTIAL Page 9 –23
Copyright © 2006 Nokia. All rights reserved.
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