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Sony HCD-M60D Service Manual

Sony HCD-M60D
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HCD-M40D/M60D/M80D
5
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
This appliance is classified as a CLASS 1 LASER product under
IEC 60825-1:2007. This marking is located on the rear exterior of
the unit.
MODEL IDENTIFICATION
- BACK PANEL -
Model Part No.
HCD-M80D: LA9
4-732-799-0[]
HCD-M80D: AUS
4-732-799-3[]
HCD-M80D: E4
4-732-799-4[]
HCD-M80D: E93
4-732-799-6[]
HCD-M80D: RU
4-732-799-7[]
HCD-M60D: LA9
4-732-800-0[]
HCD-M60D: AEP
4-732-800-1[]
HCD-M60D: AUS
4-732-800-3[]
HCD-M60D: RU
4-732-800-7[]
HCD-M40D: LA9
4-732-801-0[]
HCD-M40D: AUS
4-732-801-3[]
HCD-M40D: E4
4-732-801-4[]
HCD-M40D: E93
4-732-801-6[]
HCD-M40D: RU
4-732-801-7[]
HCD-M80D: BR
4-735-615-0[]
HCD-M60D: BR
4-735-615-1[]
DESTINATION ABBREVIATIONS
The following abbreviations for model destinations are used in this
service manual.
• Abbreviation
AUS : Australian model
BR : Brazilian model
E4 : African model
E93 : 240 V AC area in E model
LA9 : Latin-American model
RU : Russian model
– MODEL LABEL –– MODEL LABEL –
Destination Code
N° SERIE
NO. SERIE/
PART No.
°

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Sony HCD-M60D Specifications

General IconGeneral
BrandSony
ModelHCD-M60D
CategoryReceiver
LanguageEnglish

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