12 Layout
12.1 Layout Guidelines
Proper routing and placement will maintain signal integrity for high-speed signals and improve the thermal
dissipation from the TPS65982 power path. The combination of power and high-speed data signals are easily
routed if the following guidelines are followed. It is a best practice to consult with a printed circuit board (PCB)
manufacturer to verify manufacturing capabilities.
12.1.1 TPS65982 Recommended Footprints
12.1.1.1 Standard TPS65982 Footprint (Circular Pads)
Figure 12-1 shows the TPS65982 footprint using a 0.25mm pad diameter. This footprint is applicable to boards
that will be using an HDI PCB process that uses smaller vias to fan-out into the inner layers of the PCB. This
footprint requires via fill and tenting and is recommended for size-constrained applications. The circular footprint
allows for easy fan-out into other layers of the PCB and better thermal dissipation into the GND planes. Figure
12-2 shows the recommended via sizing for use under the balls. The size is 5mil hole and 10mil diameter. This
via size will allow for approximately 1.5A current rating at 3 mΩ of DC resistance with 1.6nH of inductance. It is
recommended to verify these numbers with board manufacturing processes used in fabrication of the PCB. This
footprint is available for download on the TPS65982 product folder on the TPS65982 product folder.
Figure 12-1. Top View Standard TPS65982 Footprint (Circular Pads)
TPS65982
SLVSD02E – MARCH 2015 – REVISED AUGUST 2021
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