Ublox SARA-R4 Series System Integration Manual

SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Design-in Page 114 of 157
2.11 Module footprint and paste mask
Figure 54 and Table 37 describe the suggested footprint (i.e. copper mask) and paste mask layout for SARA
modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed stencil
apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’, H’, I’, J’, O’
ones).
The Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist Mask Defined
(SMD) pad type, as it implements the solder resist mask opening 50 µm larger per side than the
corresponding copper pad.
The recommended thickness of the stencil for the soldering paste is 150 µm, according to application
production process requirements.
K
M1
M1
M2
E G H’ J’ E
ANT pin
B
Pin 1
K
G
H’
J’
A
D
D
O’
O’
L N L
I’
F’
F’
K
M1
M1
M2
E G H’’ J ’’ E
ANT pin
B
Pin 1
K
G
H’’
J ’’
A
D
D
O’’
O’’
L N L
I’’
F’’
F’’
Stencil: 150
µm
Figure 54: SARA-R4/N4 series modules suggested footprint and paste mask (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
26.0 mm
G
1.10 mm
K
2.75 mm
B
16.0 mm
H’
0.80 mm
L
2.75 mm
C
3.00 mm
H’’
0.75 mm
M1
1.80 mm
D
2.00 mm
I’
1.50 mm
M2
3.60 mm
E
2.50 mm
I’’
1.55 mm
N
2.10 mm
F’
1.05 mm
J’
0.30 mm
O’
1.10 mm

Ublox SARA-R4 Series Specifications

General

Brand	Ublox
Model	SARA-R4 Series
Category	Control Unit
Language	English