SARA-R4/N4 series - System Integration Manual
UBX-16029218 - R11 Handling and soldering Page 125 of 157
☞ u-blox gives no warranty against damages to the SARA-R4/N4 series modules caused by performing
more than a total of two soldering processes (one reflow soldering process to mount the SARA-R4/N4
series module, plus one wave soldering process to mount other THT parts on the application board).
3.3.7 Hand soldering
Hand soldering is not recommended.
3.3.8 Rework
Rework is not recommended.
☞ Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
3.3.9 Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products.
These materials affect the HF properties of the cellular modules and it is important to prevent them from
flowing into the module.
The RF shields do not provide 100% protection for the module from coating liquids with low viscosity,
therefore care is required in applying the coating.
☞ Conformal Coating of the module will void the warranty.
3.3.10 Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify
such processes in combination with the cellular modules before implementing this in production.
☞ Casting will void the warranty.
3.3.11 Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly
onto the EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to
provide optimum immunity to interference and noise.
☞ u-blox gives no warranty for damages to the cellular modules caused by soldering metal cables or any
other forms of metal strips directly onto the EMI covers.
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