63
G0 B5 B6 B7 ID10 ID8 ID6
G
GND GND
Y
GND
ID9 ID7
cond. probe
outlet probe
inlet probe
low press.
multi funct.
multi funct.
high press.
remote ON/OFF
GND
B8
V+
P
pressure
probe
temperature
probe
digital
input
Line
L
N
Tx/RxGND
Bottom
No6
C6/7 C6/7 C8/9
x C10
No7 No8 No9
C8/9
x
No10
Line
L
N
Tx/Rx GND
Top
EV Driver
t-LAN
EV driver
Expansion board
G Vbat DI1
S4V
S3 S2 S1
G0
GND
DI2
S4I
Vr1 Vr2 OC
GNX
RT+
RT-
MOLEX
¡
Mini-Fit
538-39-01-2140
1
GND
2
3
GND
4
COM NO
MOLEX
¡
Mini-Fit
538-39-01-2060
PHOENIX
¡
GMSTB 2,5/2 ST
PHOENIX
¡
MC1,5/3-ST-3,81
EEV driver
FCSER00000
ENGLISH
µC
2
SE - +030220426 - rel. 2.0 - 03.08.2009
7.2 Expansion card
This device allows the µC
2
SE to manage the second refrigerant circuit on chillers, heat pumps and
condensing units with up to 4 hermetic compressors.
The following fi gure shows the connection diagram for the µC
2
SE expansion card, code MCH200002*.
Fig. 7.b
NOTE: The expansion features two LEDs on the main board (to see these, remove the top or bottom
door), which display its status by the following messages:
ON Flashing
green LED Board powered Board powered and serial communication with µC
2
SE in progress
red LED 1 fl ash: Probe fault alarm
2 fl ashes: Zero crossing alarm (mains frequency not detected)
3 fl ashes: Serial communication alarm with EVD
4 fl ashes: Serial communication alarm with µC
2
SE
Table 7.c
The alarms are displayed in sequence and are separated from each other by pauses.
7.3 EVD4*: Electronic expansion valve driver
This device is used to control electronic expansion valves. The device is connected to the µC
2
SE via a
tLAN serial line. The condensing pressure probe must be connected to the µC
2
SE, which then sends the
reading to the driver.
Nota: for all other information on the connections, refer to the EVD4* driver manual.
Fig. 7.c
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