HP ProDesk 600 G1 Tower User Manual

Rated Input Current 5.5A
1
This system utilizes an active power factor corrected power supply. This allows the system to pass the CE mark requirements
for use in the countries of the European Union. The active power factor corrected power supply also has the added benefit of
not requiring an input voltage range select switch.
SFF specifications
Chassis (in the desktop position)
Height
Width
Depth
3.95 in
13.3 in
14.9 in
10.0 cm
33.8 cm
37.9 cm
Approximate Weight 16.7 lb 7.6 kg
Weight Supported (maximum distributed load in desktop position) 77 lb 35 kg
Temperature Range
Operating
Nonoperating
50° to 95°F
-22° to 140°F
10° to 35°C
-30° to 60°C
NOTE: Operating temperature is derated 1.0° C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level; no direct
sustained sunlight. Maximum rate of change is 10° C/Hr. The upper limit may be limited by the type and number of options
installed.
Relative Humidity (noncondensing)
Operating
Nonoperating (38.7°C max wet bulb)
10-90%
5-95%
10-90%
5-95%
Maximum Altitude (unpressurized)
Operating
Nonoperating
10,000 ft
30,000 ft
3048 m
9144 m
Power Supply
Operating Voltage Range
Rated Voltage Range
1
Rated Line Frequency
Operating Line Frequency
90-264 VAC
100-240 VAC
50-60 Hz
47-63 Hz
Standard Efficiency
High Efficiency
240W STD active PFC
240W 92% efficient active PFC / 240W 90%
efficient active PFC
SFF specifications
227

HP ProDesk 600 G1 Tower Specifications

General

Tcase	72 °C
Bus type	DMI2
Stepping	C0
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-4130
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-4100 Desktop series
Processor socket	LGA 1150 (Socket H3)
Processor threads	4
Processor codename	Haswell
Number of QPI links	0
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x8, 1x16, 2x4, 2x8
Thermal Design Power (TDP)	65, 54 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	4x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Internal memory type	DDR3-SDRAM
Memory layout (slots x size)	1 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Intel segment tagging	Enterprise, Small Business
On-board graphics card ID	0x41E
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4400
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Audio system	HD
Product type	PC
Motherboard chipset	Intel® Q85
Scalability	1S
Processor ARK ID	77480
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0
Thermal solution specification	PCG 2013C
Intel Small Business Advantage (SBA) version	1.00
Intel® Small Business Advantage (Intel® SBA)	-
Intel Stable Image Platform Program (SIPP) version	0.00
Power supply	320 W
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	442 mm
Width	170 mm
Height	399 mm
Weight	9300 g