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HP ProDesk 600 G1 Tower User Manual

HP ProDesk 600 G1 Tower
243 pages
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Never cover the ventilation slots on the monitor with any type of material.
Install or enable power management functions of the operating system or other software, including
sleep states.
Routine care
General cleaning safety precautions
1. Never use solvents or flammable solutions to clean the computer.
2. Never immerse any parts in water or cleaning solutions; apply any liquids to a clean cloth and
then use the cloth on the component.
3. Always unplug the computer when cleaning with liquids or damp cloths.
4. Always unplug the computer before cleaning the keyboard, mouse, or air vents.
5. Disconnect the keyboard before cleaning it.
6. Wear safety glasses equipped with side shields when cleaning the keyboard.
Cleaning the Computer Case
Follow all safety precautions in General cleaning safety precautions on page 31 before cleaning the
computer.
To clean the computer case, follow the procedures described below:
To remove light stains or dirt, use plain water with a clean, lint-free cloth or swab.
For stronger stains, use a mild dishwashing liquid diluted with water. Rinse well by wiping it with
a cloth or swab dampened with clear water.
For stubborn stains, use isopropyl (rubbing) alcohol. No rinsing is needed as the alcohol will
evaporate quickly and not leave a residue.
After cleaning, always wipe the unit with a clean, lint-free cloth.
Occasionally clean the air vents on the computer. Lint and other foreign matter can block the vents
and limit the airflow.
Cleaning the keyboard
Follow all safety precautions in General cleaning safety precautions on page 31 before cleaning the
keyboard.
To clean the tops of the keys or the keyboard body, follow the procedures described in
Cleaning the
Computer Case on page 31.
When cleaning debris from under the keys, review all rules in
General cleaning safety precautions
on page 31 before following these procedures:
Routine care
31

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HP ProDesk 600 G1 Tower Specifications

General IconGeneral
Tcase72 °C
Bus typeDMI2
SteppingC0
FSB ParityNo
Processor cache3 MB
Processor cores2
Processor modeli3-4130
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-4100 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads4
Processor codenameHaswell
Number of QPI links0
Processor frequency3.4 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x8, 1x16, 2x4, 2x8
Thermal Design Power (TDP)65, 54 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity500 GB
Intel segment taggingEnterprise, Small Business
On-board graphics card ID0x41E
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Recovery operating systemWindows 8 Pro
Operating system installedWindows 7 Professional
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantity6
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Audio systemHD
Product typePC
Motherboard chipsetIntel® Q85
Scalability1S
Processor ARK ID77480
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0
Thermal solution specificationPCG 2013C
Intel Small Business Advantage (SBA) version1.00
Intel® Small Business Advantage (Intel® SBA)-
Intel Stable Image Platform Program (SIPP) version0.00
Power supply320 W
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Weight and Dimensions IconWeight and Dimensions
Depth442 mm
Width170 mm
Height399 mm
Weight9300 g

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