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HP ProDesk 600 G1 Tower User Manual

HP ProDesk 600 G1 Tower
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SATA hard drive cables
SATA data cable
Always use an HP approved SATA 3.0 Gb/s cable as it is fully backwards compatible with the SATA
1.5 Gb/s drives.
Current HP desktop products ship with SATA 3.0 Gb/s hard drives.
SATA data cables are susceptible to damage if overflexed. Never crease a SATA data cable and never
bend it tighter than a 30 mm (1.18 in) radius.
The SATA data cable is a thin, 7-pin cable designed to transmit data for only a single drive.
SMART ATA drives
The Self Monitoring Analysis and Recording Technology (SMART) ATA drives for the HP Personal
Computers have built-in drive failure prediction that warns the user or network administrator of an
impending failure or crash of the hard drive. The SMART drive tracks fault prediction and failure
indication parameters such as reallocated sector count, spin retry count, and calibration retry count. If
the drive determines that a failure is imminent, it generates a fault alert.
Cable management
Always follow good cable management practices when working inside the computer.
Keep cables away from major heat sources like the heat sink.
Do not jam cables on top of expansion cards or memory modules. Printed circuit cards like these
are not designed to take excessive pressure on them.
Keep cables clear of sliding or moveable parts to prevent them from being cut or crimped when
the parts are moved.
When folding a flat ribbon cable, never fold to a sharp crease. Sharp creases may damage the
wires.
Some flat ribbon cables come prefolded. Never change the folds on these cables.
Do not bend any cable sharply. A sharp bend can break the internal wires.
Never bend a SATA data cable tighter than a 30 mm (1.18 in) radius.
Never crease a SATA data cable.
Do not rely on components like the drive cage, power supply, or computer cover to push cables
down into the chassis. Always position the cables to lay properly by themselves.
SATA hard drive cables
35

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HP ProDesk 600 G1 Tower Specifications

General IconGeneral
Tcase72 °C
Bus typeDMI2
SteppingC0
FSB ParityNo
Processor cache3 MB
Processor cores2
Processor modeli3-4130
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-4100 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads4
Processor codenameHaswell
Number of QPI links0
Processor frequency3.4 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x8, 1x16, 2x4, 2x8
Thermal Design Power (TDP)65, 54 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity500 GB
Intel segment taggingEnterprise, Small Business
On-board graphics card ID0x41E
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Recovery operating systemWindows 8 Pro
Operating system installedWindows 7 Professional
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantity6
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Audio systemHD
Product typePC
Motherboard chipsetIntel® Q85
Scalability1S
Processor ARK ID77480
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0
Thermal solution specificationPCG 2013C
Intel Small Business Advantage (SBA) version1.00
Intel® Small Business Advantage (Intel® SBA)-
Intel Stable Image Platform Program (SIPP) version0.00
Power supply320 W
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Weight and Dimensions IconWeight and Dimensions
Depth442 mm
Width170 mm
Height399 mm
Weight9300 g

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