HP Z210 User Manual

5. Disconnect the CPU heatsink fan cable from the system board (1) as shown in the following figure.
Figure 5-39 Disconnecting the heatsink fan cable
6. Before lifting the heatsink, gently twist the heatsink to break the thermal compound between the
CPU and the heatsink.
7. Lift the CPU heatsink out of the chassis (2).
8. Use alcohol and a soft cloth to clean the thermal interface residue from the CPU and the heatsink.
Allow the alcohol on the CPU and CPU heatsink to dry completely.
Installing the CPU heatsink
To install a heatsink:
1. Disconnect power from the workstation (see
Predisassembly procedures on page 62).
2. Remove the side access panel (see
Removing the side access panel on page 65).
3. Remove the CPU heatsink (see
Removing the CPU heatsink on page 98).
4. Perform one of the following tasks:
●
If you are reusing the original heatsink, apply thermal compound to the center of the CPU top
surface.
●
If you are using a new CPU heatsink, do not apply thermal compound to the CPU because
the new heatsink already has thermal compound applied to the heatsink surface. Instead,
remove the thermal compound protective liner from the bottom of the new heatsink.
5. Align the heat sink's four mounting screws with the mounting holes in the chassis.
6. Carefully place the heatsink on the CPU.
7. Tighten each heatsink screw a little at a time to ensure that the CPU stays level. Do not fully tighten
one screw and then move on to the next.
ENWW
Removing and installing components
99

HP Z210 Specifications

General

Tcase	72.6 °C
Bus type	DMI
Stepping	D2
FSB Parity	No
Processor cache	6 MB
Processor cores	4
Processor model	E3-1225
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200
Processor socket	LGA 1155 (Socket H2)
Processor codename	Sandy Bridge
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	3.4 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	31
Maximum number of PCI Express lanes	20
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
Graphics card	Quadro 600
Dimensions (WxDxH)	100 x 381 x 338 mm
Networking features	Gigabit Ethernet (10/100/1000)
Graphics card family	NVIDIA
Maximum internal memory	16384 MB
Graphics card manufacturer	Nvidia
Audio system	ALC261
Product type	Workstation
Motherboard chipset	Intel® C206
Memory slots	4x DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Memory layout (slots x size)	- GB
HDD speed	- RPM
RAID levels	0, 1
HDD capacity	500 GB
SSD capacity	160 GB
HDD interface	SATA II
SSD interface	SATA
Optical drive type	DVD-RW
Total HDDs capacity	1000 GB
Card reader integrated	-
Number of HDDs installed	2
Maximum graphics card memory	1.024 GB
On-board graphics card model	Intel® HD Graphics P3000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	850 MHz
On-board graphics card dynamic frequency (max)	1350 MHz
USB 2.0 ports quantity	14
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Chassis type	SFF
Product color	Black
Country of origin	China
Compatible operating systems	Windows 7
Power supply	240 W
Certification	ENERGY STAR 5.0
Processor code	SR00G
Processor ARK ID	52270
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	381 mm
Width	100 mm
Height	338 mm
Weight	7600 g