Raisecom
ISCOM RAX711 (B) Product Description
Raisecom Technology Co., Ltd.
Contents
1 Overview ......................................................................................................................................... 1
1.1 Introduction ...................................................................................................................................................... 1
1.2 Characters ......................................................................................................................................................... 1
1.3 Features ............................................................................................................................................................ 2
1.4 Ordering information........................................................................................................................................ 4
1.4.1 Naming convention ................................................................................................................................. 4
1.4.2 Ordering information about device ......................................................................................................... 4
1.4.3 Ordering information about auxiliary parts ............................................................................................. 5
2 Networking applications ................................................................................................................. 7
2.1 SME access and mobile backhaul networking ................................................................................................. 7
2.2 Typical end-to-end ELPS networking .............................................................................................................. 8
2.3 Typical ERPS networking ................................................................................................................................ 9
3 System structure ............................................................................................................................ 10
3.1 Appearance ..................................................................................................................................................... 10
3.2 Interfaces ........................................................................................................................................................ 11
3.2.1 Service interfaces .................................................................................................................................. 11
3.2.2 Management interfaces ......................................................................................................................... 13
3.2.3 Power interfaces .................................................................................................................................... 14
3.3 LEDs .............................................................................................................................................................. 15
3.4 Hardware logic structure ................................................................................................................................ 16
4 Device installation ......................................................................................................................... 19
4.1 Installing hardware ......................................................................................................................................... 19
4.2 Safety precautions .......................................................................................................................................... 19
4.2.2 Preparing for installation ....................................................................................................................... 20
4.2.3 Installing device .................................................................................................................................... 20
4.2.4 Connecting cables ................................................................................................................................. 22
4.3 Installing software .......................................................................................................................................... 26
5 Technical specifications................................................................................................................. 27
5.1 Integrated machine parameters ....................................................................................................................... 27
5.2 Laser security class ........................................................................................................................................ 28
5.3 Reliability specifications ................................................................................................................................ 28