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Siemens C55 Repair Documentation

Siemens C55
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V1.20 Page 45 of 48 ICM MP CCQ GRM
A55/C55_Hitachi Company Confidential © Copyright Siemens AG 04/03
8 Acoustic
The buzzer and the keypad clicks will be realized over the earpiece. At normal buzzer
the signaling will realized with swelling tones. At the same time a maximum sound
pressure level in the coupler of 135 +/- 5dB(A) is fixed.
The standard sounds will be generated by the EGOLD+, the advanced sounds will be
generated via firmware running on the DSP.
8.1 Microphone
8.1.1 Mechanical
The microphone is built in the Mounting Frame Lower Part and is mechanically fixed
with a rubber seal (gasket). The contact on the PCB is realised via spiral springs,
which are integrated in the gasket. Because of usage of Unidirectional Microphone,
the gasket has a front- and a back sound-inlet hole. The front sound-inlet is
acoustically tighten connected with a sound-inlet at the rear-side of the mounting
frame lower part. The back sound-inlet is acoustically tighten connected with a sound-
inlet at the bottom-side of the mounting frame lower part. The gasket of the
microphone has a asymmetrical shape in order to provide non-rotating, guaranteed
covering of the sound-inlets of mounting frame lower part to the corresponding sound-
inlets at microphone gasket.
8.1.2 Electrical
Both Microphones are directly connected to the EGOLD+.(Analog Interface G2, F1-G3, H2)
via the signals MICN1, MICP1 (Internal Microphone )and MICN2, MICP2 (External
Microphone/Headset). Power supply for the Microphone is VMIC (EGOLD+.(
Analog
Interface G1)
)

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Siemens C55 Specifications

General IconGeneral
BrandSiemens
ModelC55
CategoryCell Phone
LanguageEnglish

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