Dell PowerEdge R310 User Manual

Installing System Components 135
SAS Backplane
Removing the SAS Backplane
CAUTION: Many repairs may only be done by a certified service technician. You
should only perform troubleshooting and simple repairs as authorized in your
product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered
by your warranty. Read and follow the safety instructions that came with the
product.
1 Turn off the system and attached peripherals, and disconnect the system
from the electrical outlet.
2 Open the system. See "Opening the System" on page 78.
CAUTION: To prevent damage to the drives and backplane, you must remove the
hard drives from the system before removing the backplane.
CAUTION: You must note the number of each hard drive and temporarily label
them before removal so that you can replace them in the same locations.
3 Remove all hard drives. See "Removing a Hard-Drive Carrier" on page 84.
4 Disconnect the power cable from the SAS backplane.
5 Disconnect the SAS data cables from the backplane. See Figure 3-25.
6 Remove the optical drive cable, control panel cable, power cable, data
cables, and USB cables.
7 Press the two blue retention latches at either ends of the SAS backplane
and lift it upwards and out of the retention hooks. Be careful to avoid
damaging the other components on the face of the board. See Figure 3-25.
8 Place the SAS backplane face down on a work surface.
R310HOM.book Page 135 Thursday, March 4, 2010 1:03 AM

Dell PowerEdge R310 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBJH
Processor cache	8 MB
Processor cores	4
Processor model	X3470
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor threads	8
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.93 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	22
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
Optical drive type	DVD-RW
Total storage capacity	500 GB
Maximum storage capacity	8 TB
Number of HDDs installed	-
Memory slots	6x DIMM
Internal memory	2 GB
Graphics card	G200eW
LAN controller	Broadcom BCM5716
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Power supply	350 W
Compatible operating systems	Windows Server Novell Linux Solaris10
Chassis type	Rack (1U)
Processor ARK ID	42932
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	610 mm
Width	434 mm
Height	42.4 mm