Dell PowerEdge R310 User Manual

Installing System Components 143
Installing the System Board
1 Unpack the new system board.
2 Remove the labels from the processor shield and affix them to the system
identification panel on the front of the system. See Figure 1-1.
3 Holding the system board by its edges, lower it into the chassis.
CAUTION: Do not lift the system board assembly by grasping a memory module,
processor, or other components.
4 Slightly lift up the front of the system board and maneuver the system
board to the bottom of the chassis until it lays completely flat.
5 Push the system board toward the back of the chassis until the board is in
place.
6 Tighten the ten screws that secure the system board to the chassis.
See Figure 3-27.
7 Transfer the processor and the heat sink to the new system board.
See "Removing a Processor" on page 120 and "Installing a Processor" on
page 124.
8 Replace all the memory modules. See "Installing Memory Modules" on
page 109.
9 Connect the cables in the order listed below (see Figure 6-1 for the
locations of the connectors on the system board):
• SATA interface cable, if applicable
• Control panel interface cable
• Optical drive power cable
• Control panel USB interface cable
• System board power cables
10 Install the expansion card, if any. See "Installing an Expansion Card" on
page 94.
11 Replace the system battery. See "Replacing the System Battery" on
page 130.
1 screws (9) 2 system board assembly
R310HOM.book Page 143 Thursday, March 4, 2010 1:03 AM

Dell PowerEdge R310 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBJH
Processor cache	8 MB
Processor cores	4
Processor model	X3470
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor threads	8
Processor codename	Lynnfield
Motherboard chipset	Intel® 3420
Processing Die size	296 mm²
Processor frequency	2.93 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	22
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
Optical drive type	DVD-RW
Total storage capacity	500 GB
Maximum storage capacity	8 TB
Number of HDDs installed	-
Memory slots	6x DIMM
Internal memory	2 GB
Graphics card	G200eW
LAN controller	Broadcom BCM5716
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Power supply	350 W
Compatible operating systems	Windows Server Novell Linux Solaris10
Chassis type	Rack (1U)
Processor ARK ID	42932
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	610 mm
Width	434 mm
Height	42.4 mm