HP ProLiant ML370 G6 User Manual

Operations 28
o
Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).
o Extend the server from the rack (on page 24).
3. Remove the access panel (on page 25).
4. Disconnect the cable from the cache module only if the battery pack is not being used to recover data
from the server or transfer data to another server.
5. Remove the battery pack.
To replace the component, reverse the removal procedure.
Remove the air baffle
1. Power down the server (on page 22).
2. Do one of the following:
o Open or remove the tower bezel, as needed ("Open or remove the tower bezel" on page 22).
o Extend the server from the rack (on page 24).
3. Remove the access panel (on page 25).
4. Remove fan 5 (on page 26).
5. If installed, remove the BBWC battery pack or the FBWC capacitor pack (on page 27).

HP ProLiant ML370 G6 Specifications

General

Processor	Intel Xeon 5500 and 5600 series
Processor Sockets	2
Memory	Up to 192 GB DDR3
Memory Slots	18 DIMM slots
Form Factor	5U Tower
Storage	Up to 16 SFF drives or 8 LFF drives
Expansion Slots	6 total: 2 x8 PCIe Gen2, 2 x4 PCIe Gen2, 1 x8 PCIe Gen2, 1 x4 PCI
Network	Embedded Dual Port Gigabit Ethernet
Power Supply	Redundant hot-plug power supplies
Operating System Support	Windows, RHEL, SLES, VMware