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HP ZBook 14U G5 User Manual

HP ZBook 14U G5
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive eld service tools, such as cutters, screwdrivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
34 Chapter 4 Removal and replacement procedures preliminary requirements

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HP ZBook 14U G5 Specifications

General IconGeneral
Form factorClamshell
Product typeMobile workstation
Product colorSilver
Country of originChina
Market positioningBusiness
LED backlightYes
Display diagonal14 \
Display brightness220 cd/m²
Native aspect ratio16:9
sRGB coverage (typical)67 %
Memory slots1x SO-DIMM
Internal memory8 GB
Memory clock speed2400 MHz
Memory form factorSO-DIMM
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express
Storage mediaSSD
SSD memory typeTLC
Total storage capacity256 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Discrete GPU manufacturerAMD
On-board graphics card ID0x5917
Discrete graphics card modelAMD Radeon Pro WX 3100
On-board graphics card modelIntel® UHD Graphics 620
Discrete graphics card memory2 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® UHD Graphics
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of built-in speakers2
Front camera HD typeHD
Front camera signal format720p
Antenna type-
Wi-Fi standards802.11a, 802.11b, 802.11g, Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac)
Bluetooth version4.2
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDMI version1.4
Charging port typeDC-in jack
USB 2.0 ports quantity0
Pointing deviceClickpad
Operating system architecture64-bit
Sustainability certificatesENERGY STAR
AC adapter power65 W
Battery capacity50 Wh
Number of battery cells3
HP speaker typeHP Dual Speakers
Bus typeOPI
SteppingY0
Tjunction100 °C
Processor cache6 MB
Processor cores4
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor socketBGA 1356
Processor threads8
Processor codenameKaby Lake R
Configurable TDP-up25 W
Processor frequency1.6 GHz
Processor cache typeL3
Configurable TDP-down10 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.4 GHz
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency1.8 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR3LA
Processor ARK ID124967
Processor package size42 X 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth234.3 mm
Width326 mm
Height17.9 mm
Weight1480 g

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