Processor Thermal/Mechanical Information
R
24 Thermal/Mechanical Design Guide
To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have
been integrated into the silicon of the Pentium 4 processor in the 775–land LGA package. By
taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution
cost by designing to TDP instead of maximum power. Thermal Monitor attempts to protect the
processor during sustained workload above TDP. Implementation options and recommendations
are described in Chapter
4.
2.4.3 Summary
In summary, considerations in heatsink design include:
• The local ambient temperature T
A
at the heatsink, which is a function of chassis design.
• The thermal design power (TDP) of the processor, and the corresponding maximum T
C
as
calculated from the thermal profile. These parameters are usually combined in a single
cooling performance parameter, Ψ
CA
(case to air thermal characterization parameter). More
information on the definition and the use of Ψ
CA
is given Section 3.1.
• Heatsink interface to IHS surface characteristics, including flatness and roughness.
• The performance of the thermal interface material used between the heatsink and the IHS.
• The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life of the
product (Refer to Section
2.1.2.2 for further information).
• Surface area of the heatsink.
• Heatsink material and technology.
• Volume of airflow over the heatsink surface area.
• Development of airflow entering and within the heatsink area.
• Physical volumetric constraints placed by the system
2.5 System Integration Considerations
Boxed Intel
®
Pentium
®
4 Processor in the 775-Land LGA Package - Integration Video provides
best known methods for package and heatsink installation and removal for LGA775 socket based
platforms and systems manufacturing. The video is available on the Web, from
http://www.intel.com/go/integration
.
§
To Next Page
Loading...
Need help?
General
