LGA775 Socket Heatsink Loading
R
66 Thermal/Mechanical Design Guide
A.3 Heatsink Selection Guidelines
Evaluate carefully heatsinks that use motherboard stiffening devices (like backing plates), and
conduct board deflection assessments based on the board deflection metric.
Solutions derived from the reference design comply with the reference heatsink preload, for
example:
• The Intel Boxed Pentium 4 Processor in the 775–land LGA package.
• The Intel RCBFH-3 Reference Design available from licensed suppliers (refer to
Appendix H for contact information).
Intel is also collaborating with vendors participating in its third party test house program to
evaluate third party solutions. Vendor information will be available and updated regularly after
product launch at http://developer.intel.com. After selecting the processor, go to the processor
technical information page, and then select “Support component”.
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