Intel EM64T - Celeron D 336 Boxed Ena User Manual

Intel® Thermal/Mechanical Reference Design Information
R
Thermal/Mechanical Design Guide 39
5 Intel
®
Thermal/Mechanical
Reference Design Information
5.1 Intel Validation Criteria for the Reference Design
5.1.1 Heatsink Performance Target
Table 2 provides the heatsink performance target for the Pentium 4 processor in the 775–land
LGA package. The thermal profiles for the Pentium 4 processor 5xx sequence and Pentium 4
processor 6xx sequence and Pentium 4 processor Extreme Edition are derived so that a single
thermal solution will satisfy these processors.
The table also includes a T
A
assumption of 38 °C for the Intel reference thermal solution at the
processor fan heatsink inlet discussed Section
3.3. An external ambient temperature to the chassis
of 35 °C is assumed, resulting in a temperature rise, T
R
, of 3 °C. Meeting T
A
and Ψ
CA
targets can
maximize processor performance (refer to Sections
2.2, 2.4, and Chapter 4). By minimizing T
R
, in
the performance chassis, this helps lead to improved acoustics.
Refer to the datasheet for detailed processor thermal specifications.
Table 2. ATX Reference Heatsink Performance Target
Processor Number Thermal Performance, Ψca
(Mean + 3σ)
Comments T
A
Assumption
Intel
®
Pentium
®
4 Processor
670/672, 660/662, 650, 640, and
630
0.28 °C/W RCBFH-3 T
A
= 38 °C
Intel
®
Pentium
®
4 Processors
570/571, 560/561, 550/551,
540/541, 530/531, and 520/521
0.29 °C/W RCBFH-3 T
A
= 38 °C
NOTES:
1. The target performance in
Table 2 is the Thermal Profile for processors with PRB=1.
2. Solutions to support processors with PRB=0 may be derived from designs supporting the thermal profile
for processors with PRB=1.
3. Refer to Section
5.6 for complete description of the Intel ATX reference solution RCBFH-3.

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English