Intel EM64T - Celeron D 336 Boxed Ena User Manual

Case Temperature Reference Metrology
R
Thermal/Mechanical Design Guide 79
The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner
of the package) is shown in
Figure 28 for the 775-land LGA package IHS.
Figure 28. IHS Reference Groove on the 775-Land LGA Package
When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket
load lever, and on the opposite side of the lever, as shown in
Figure 29.
Figure 29. IHS Groove Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of complying with drawing specified tolerances. IHS
channel geometry is critical for repeatable placement of the thermocouple bead, ensuring precise
thermal measurements. The specified dimensions minimize the impact of the groove on the IHS
under the socket load. A larger groove may cause the IHS to warp under the socket load such that
it does not represent the performance of an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Pin1 indicator
IHS Groove

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English