Intel® Thermal/Mechanical Reference Design Information
R
44 Thermal/Mechanical Design Guide
5.2.2 Power Cycling
Thermal performance degradation due to TIM degradation is evaluated using power cycling
testing. The test is defined by 7,500 cycles for the case temperature from room temperature
(~23 ºC) to the maximum case temperature defined by the thermal profile at TDP.
5.2.3 Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental stresses, with
the thermal mechanical enabling components assembled. The test shall be conducted on a fully
operational motherboard that has not been exposed to any testing prior to the test being
considered.
Testing setup should include the following components, properly assembled and/or connected:
• Appropriate system motherboard
• Processor
• All enabling components, including socket and thermal solution parts
• Power supply
• Disk drive
• Video card
• DIMM
• Keyboard
• Monitor
The pass criterion is that the system under test shall successfully complete the checking of BIOS,
basic processor functions and memory, without any errors.
5.3 Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose
materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic
materials such as PVC formulations, certain polyurethane compositions (e.g., polyester and some
polyethers), plastics that contain organic fillers of laminating materials, paints, and varnishes also
are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-
810E, Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel
recycling standards.
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