Intel EM64T - Celeron D 336 Boxed Ena User Manual

R
Thermal/Mechanical Design Guide 3
Contents
1 Introduction ......................................................................................................................... 9
1.1 Document Goals and Scope .................................................................................. 9
1.1.1 Importance of Thermal Management ..................................................... 9
1.1.2 Document Goals ..................................................................................... 9
1.1.3 Document Scope .................................................................................. 10
1.2 References ........................................................................................................... 11
1.3 Definition of Terms ............................................................................................... 12
2 Processor Thermal/Mechanical Information ..................................................................... 15
2.1 Mechanical Requirements.................................................................................... 15
2.1.1 Processor Package............................................................................... 15
2.1.2 Heatsink Attach..................................................................................... 17
2.1.2.1 General Guidelines.............................................................. 17
2.1.2.2 Heatsink Clip Load Requirement ........................................ 17
2.1.2.3 Additional Guidelines........................................................... 18
2.2 Thermal Requirements......................................................................................... 18
2.2.1 Processor Case Temperature .............................................................. 18
2.2.2 Thermal Profile...................................................................................... 19
2.2.3 T
CONTROL
................................................................................................ 20
2.3 Heatsink Design Considerations .......................................................................... 21
2.3.1 Heatsink Size ........................................................................................ 22
2.3.2 Heatsink Mass ...................................................................................... 22
2.3.3 Package IHS Flatness ..........................................................................22
2.3.4 Thermal Interface Material.................................................................... 23
2.4 System Thermal Solution Considerations ............................................................ 23
2.4.1 Chassis Thermal Design Capabilities................................................... 23
2.4.2 Improving Chassis Thermal Performance ............................................ 23
2.4.3 Summary............................................................................................... 24
2.5 System Integration Considerations ...................................................................... 24
3 Thermal Metrology ............................................................................................................ 25
3.1 Characterizing Cooling Performance Requirements............................................ 25
3.1.1 Example ................................................................................................ 26
3.2 Processor Thermal Solution Performance Assessment ...................................... 27
3.3 Local Ambient Temperature Measurement Guidelines........................................ 27
3.4 Processor Case Temperature Measurement Guidelines..................................... 30
4 Thermal Management Logic and Thermal Monitor Feature ............................................. 31
4.1 Processor Power Dissipation ...............................................................................31
4.2 Thermal Monitor Implementation.......................................................................... 31
4.2.1 PROCHOT# Signal............................................................................... 32
4.2.2 Thermal Control Circuit......................................................................... 32
4.2.3 Operation and Configuration................................................................. 33

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English