R
Thermal/Mechanical Design Guide 7
Figure 48. Reference Clip Drawings – Sheet 1 ................................................................
97
Figure 49. Reference Clip Drawings – Sheet 2 ................................................................ 98
Figure 50. Reference Fastener – Sheet 1 ........................................................................ 99
Figure 51. Reference Fastener – Sheet 2 ......................................................................100
Figure 52. Reference Fastener – Sheet 3 ......................................................................101
Figure 53. Reference Fastener – Sheet 4 ......................................................................102
Figure 54. Clip/Heatsink Assembly ................................................................................. 103
Figure 55. Intel(R) RCBFH-3 Reference Solution Assembly.......................................... 104
Tables
Table 1. Thermal Diode Interface ..................................................................................... 35
Table 2. ATX Reference Heatsink Performance Target ................................................... 39
Table 3. Fan Electrical Performance Requirements......................................................... 41
Table 4. Intel
®
RCBFH-3 Reference Design Performance ............................................... 46
Table 5. Board Deflection Configuration Definitions......................................................... 62
Table 6. Typical Test Equipment ......................................................................................70
Table 7. FSC Definitions ................................................................................................... 87
Table 8. ATX FSC Settings............................................................................................... 89
Table 9. Balanced Technology Extended (BTX) FSC Settings ........................................ 89
Table 10. Intel Representative Contact for Licensing Information.................................. 105
Table 11. Intel Reference Component Thermal Solution Provider ................................. 105