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Quectel EG06 Series User Manual

Quectel EG06 Series
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LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 64 / 89
5 Antenna Interfaces
EG06 includes a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall
of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The
impedance of antenna port is 50Ω.
5.1. Main/Rx-diversity Antenna Interface
5.1.1. Pin Definition
The pin definition of main antenna and Rx-diversity antenna interfaces are shown below.
Table 29: Pin Definition of the RF Antenna
5.1.2. Operating Frequency
Table 30: Module Operating Frequencies
Pin Name
Pin No.
I/O
Description
Comment
ANT_MAIN
107
IO
Main antenna pad
50Ω impedance
ANT_DIV
127
AI
Receive diversity antenna pad
50Ω impedance
3GPP Band
Transmit
Receive
Unit
WCDMA B1
1920~1980
2110~2170
MHz
WCDMA B2
1850~1910
1930~1990
MHz
WCDMA B3
1710~1785
1805~1880
MHz
WCDMA B4
1710~1755
2110~2155
MHz
WCDMA B5
824~849
869~894
MHz
WCDMA B6
830~840
875~885
MHz

Table of Contents

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Quectel EG06 Series Specifications

General IconGeneral
Module TypeLTE Cat 6 Module
CategoryControl Unit
LTE CategoryCat 6
Max Download Speed300 Mbps
Max Upload Speed50 Mbps
Operating Temperature-40°C to +85°C
Storage Temperature-40°C to +90°C
Power ConsumptionTBD
SIM Interface1.8V/3.0V
GNSSGPS/GLONASS/BeiDou/Galileo/QZSS
Power Supply3.3V
ProtocolsTCP/IP, UDP, HTTP, FTP
CertificationsCE, FCC, GCF, PTCRB
InterfaceUSB 2.0, UART
Network SupportLTE, WCDMA, GSM
Form FactorM.2
Dimensions30.0 × 42.0 × 2.3 mm

Summary

Introduction

Safety Information

Essential safety precautions for operating the EG06 module during all phases of use.

Product Concept

General Description

Overview of the EG06 series modules and their supported networks.

Key Features

Detailed features of the EG06 module, including power, LTE, UMTS, and interfaces.

Functional Diagram

Block diagram illustrating the EG06 module's major functional parts and interfaces.

Evaluation Board

Information on the EG06 evaluation board (EVB) and peripherals for application development.

Application Interface

General Description

Description of EG06 LGA pads and the sub-interfaces covered in the document.

Pin Assignment

Detailed pin assignment diagram for the EG06 module, showing pin names and numbers.

Pin Description

Definition and description of EG06 module pins, including DC characteristics.

Operating Modes

Summary of various operating modes of the EG06 module, such as Idle, Sleep, and Airplane mode.

Power Saving

Procedures and applications for enabling sleep mode on the EG06 module via UART or USB.

Power Supply

Details on EG06 power supply pins, voltage requirements, and reference designs for stable power.

Turn on and off Scenarios

Procedures for turning the EG06 module on and off using the PWRKEY pin or AT commands.

Reset the Module

Method for resetting the EG06 module using the RESET_N pin, including circuit and timing.

(U)SIM Interface

(U)SIM interface circuitry, pin definitions, and reference designs for 8-pin and 6-pin connectors.

USB Interface

Definition and reference circuit for the EG06 module's USB interface, supporting USB 3.0/2.0.

UART Interfaces

Description of main, debug, and BT UART interfaces, including pin definitions and logic levels.

PCM and I2C Interfaces

PCM and I2C interfaces for audio communication, including modes, timing, and pin definitions.

ADC Interfaces

Definition and characteristics of the EG06 module's two Analog-to-Digital Converter (ADC) interfaces.

Network Status Indication

Network status indication pins (NET_MODE, NET_STATUS) and their working states.

STATUS

Definition of the STATUS pin as a module operation status indicator.

Behavior of the RI

Configuration and default behavior of the RI (Ring Indicator) pin for URC notifications.

PCle Interface*

Features and pin definition of the EG06 module's PCI Express interface.

WLAN Control Interface*

Control interface for WLAN design, including pin definitions for coexistence and control signals.

SD Card Interface

SD card interface supporting SD 3.0 protocol, including pin definitions and reference circuits.

SPI Interface

SPI interface details, including pin definitions, timing parameters, and reference circuit with level translator.

USB_BOOT Interface

USB_BOOT interface for entering emergency download mode and firmware upgrade.

GNSS Receiver

General Description

Description of the EG06 GNSS receiver solution and its supported satellite systems.

GNSS Performance

GNSS performance metrics including sensitivity, TTFF, and accuracy.

Layout Guidelines

Layout guidelines for the EG06 GNSS antenna and related circuits to ensure performance.

Antenna Interfaces

Main/Rx-diversity Antenna Interface

Pin definition and operating frequencies for the main and Rx-diversity antenna interfaces.

GNSS Antenna Interface

Pin definition and frequency specifications for the GNSS antenna interface.

Antenna Installation

Requirements for main, Rx-diversity, and GNSS antennas, and recommended RF connectors.

Electrical, Reliability and Radio Characteristics

Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on EG06 module pins.

Power Supply Ratings

Power supply ratings for VBAT and USB_VBUS, including typical and maximum values.

Operation and Storage Temperatures

Operating and storage temperature ranges for the EG06 module, including extended ranges.

Current Consumption

Typical current consumption of the EG06 module in various states like sleep, idle, and data transfer.

RF Output Power

RF output power specifications for WCDMA, LTE-FDD, and LTE-TDD bands.

RF Receiving Sensitivity

Conducted RF receiving sensitivity for EG06 module across various frequency bands and configurations.

Electrostatic Discharge

Electrostatic discharge characteristics of the EG06 module and handling precautions.

Thermal Consideration

Principles for thermal management, heatsink designs, and placement to ensure optimal module performance.

Mechanical Dimensions

Mechanical Dimensions of the Module

Mechanical dimensions of the EG06 module, including top, side, and overall size.

Recommended Footprint

Recommended PCB footprint for the EG06 module, including pad layout and dimensions.

Design Effect Drawings of the Module

Design effect drawings showing the top and bottom views of the EG06 module.

Storage, Manufacturing and Packaging

Storage

Storage conditions, shelf life, and handling requirements for EG06 modules after opening the vacuum seal.

Manufacturing and Soldering

Guidelines for manufacturing and soldering the EG06 module, including reflow soldering thermal profile.

Packaging

Details on EG06 module packaging, including tape and reel carrier specifications.

IC & FCC Requirement

FCC Regulations:

FCC compliance statement and regulations for the EG06 module, including interference guidelines.

RF Exposure Information

RF exposure compliance information and minimum human proximity requirements for the EG06 module.

ISED Notice

ISED (Canada) notice regarding device compliance with license-exempt RSS standards.

ISED Radiation Exposure Statement

ISED radiation exposure limits and human proximity requirements for the EG06 module.

USERS MANUAL OF THE END PRODUCT:

Guidance for end-user manuals regarding antenna separation and FCC compliance for the EG06 module.

LABEL OF THE END PRODUCT:

Requirements for labeling the end product containing the EG06 module with FCC and ISED information.

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