LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 87 / 89
8.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module should be 0.18mm. For more details, please refer to document [3].
It is suggested that the peak reflow temperature is 235ºC ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below:
Figure 48: Reflow Soldering Thermal Profile
8.3. Packaging
EG06 is packaged in tape and reel carriers. One reel is 10.56 meters long and contains 200 modules. The
figures below show the packaging details, measured in mm.
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