Dell PowerEdge 2950 User Manual

Installing System Components 105
7 Reinstall the SAS controller daughter card. See "Installing a SAS Controller Daughter Card" on
page 70.
8 Reattach the SAS controller daughter card cables and the control panel cable. See "SAS and SAS RAID
Controller Daughter Card Cabling Guidelines" on page 72.
9 Reinstall the hard drives. See "Installing a Hot-Plug Hard Drive" on page 57.
NOTE: Reinstall the hard drives in the same drive bays from which they were removed.
10 If applicable, reconnect the internal tape drive. See "Removing and Installing an Internal SCSI Tape
Drive" on page 86.
11 If applicable, reconnect the diskette drive. See "Installing the Diskette Drive Into the System" on
page 84.
12 If applicable, reconnect the optical drive. See "Installing the Optical Drive" on page 82.
13 Close the system. See "Closing the System" on page 55.
Control Panel Assembly (Service-only Procedure)
NOTE: The control panel assembly consists of two separate modules—the display module and the control panel
circuit board. Use the following instructions to remove and install either module.
Removing the Control Panel Assembly
CAUTION: Only trained service technicians are authorized to remove the system cover and access any of the
components inside the system. See your Product Information Guide for complete information about safety
precautions, working inside the computer, and protecting against electrostatic discharge.
1 If applicable, remove the bezel. See "Removing the Front Bezel" on page 53.
2 Turn off the system and attached peripherals, and disconnect the system from the electrical outlet and
peripherals.
3 Open the system. See "Opening the System" on page 54.
4 Disconnect the control panel cable at back of the control panel board. See Figure 3-35.
NOTICE: Do not pull on the cable to unseat the connector. Doing so can damage the cable.
a
Squeeze the metal tabs on the ends of the cable connector.
b Gently work the connector out of the socket.
5 Disconnect the display module cable from the control panel board. See Figure 3-35.
6 Remove the three screws that secure the control panel board to the system chassis and remove the
board. See Figure 3-35.
7 Remove the display module:
a Insert the end of paper clip into the hole on the right side of the display module and gently pry off
the label.
Book.book Page 105 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g