Dell PowerEdge 2950 User Manual

Installing System Components 81
6 Align the front edge of the RAC card with the two front plastic retention standoffs adjacent to the
RAC system board connector, and press down the side of the card until it is fully seated. See
Figure 3-20.
When the front of the card is fully seated, the plastic standoff snaps over the edge of the card.
7 Connect the two short ribbon cables to the RAC card and the system board. See Figure 6-2 for the
connector locations
NOTICE: Be careful when attaching cables to the system board that you do not damage the surrounding system
board components.
a
Connect one cable to connector 1 on the RAC card and to RAC_CONN1 on the system board.
b Connect the second cable to connector 2 on the RAC card and to RAC_CONN2 on the system
board.
Reinstall the central riser board. See "Installing the Central Riser Board" on page 100.
NOTICE: When detaching the RAC cables from the system board, squeeze the metal ends of the cable connectors
and gently work the connector out of the socket. Do not pull on the cable to unseat the connector. Doing so can
damage the cable.
8 Close the system. See "Closing the System" on page 55.
9 Reconnect the system and peripherals to their power sources, and turn them on.
See the RAC card documentation for information on configuring and using the RAC card.
Optical Drive
An optional slimline optical drive is mounted on a tray that slides in the front panel and connects to the
controllers on the system board through the SAS backplane board.
Removing the Optical Drive
CAUTION: Only trained service technicians are authorized to remove the system cover and access any of the
components inside the system. See your Product Information Guide for complete information about safety
precautions, working inside the computer, and protecting against electrostatic discharge.
1 Turn off the system, including any attached peripherals, and disconnect the system from its electrical
outlet.
2 Remove the bezel. See "Removing the Front Bezel" on page 53.
3 Open the system. See "Opening the System" on page 54
4 Disconnect the optical drive cable from the back of the drive.
5 To remove the optical drive, press down and forward on the blue tray release tab and slide the drive tray
out of the system. See Figure 3-21.
Book.book Page 81 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g