Dell PowerEdge 2950 User Manual

90 Installing System Components
Non-Optimal Memory Configurations
System performance can be affected if your memory configuration does not conform to the preceding
installation guidelines. Your system may issue an error message during startup stating that your memory
configuration is non-optimal.
Memory Sparing Support
The system supports memory sparing if eight identical memory modules are installed in the system. The
memory sparing feature must be enabled in the System Setup program and can be used only if memory
mirroring is not enabled.
Memory sparing allocates four ranks of DIMM memory to the spare bank. These four ranks consist of the
first rank of memory in DIMM sockets 1 through 4. For single-rank DIMMs, the entire capacity of the
four DIMMs is allocated to sparing whereas for dual-rank DIMMs, only half of the four-DIMM capacity
is allocated to sparing. Table 3-2 shows how memory sparing splits the available and spared memory in
each of the single- and dual-ranked memory module combinations.
Memory Mirroring Support
The system supports memory mirroring if eight identical memory modules are installed in the system.
Mirroring must be enabled in the System Setup program and can be used only if memory sparing is not
enabled. In a mirrored configuration, the total available system memory is one-half of the total installed
memory.
Installing Memory Modules
CAUTION: Only trained service technicians are authorized to remove the system cover and access any of the
components inside the system. See your Product Information Guide for complete information about safety
precautions, working inside the computer, and protecting against electrostatic discharge.
1 Turn off the system, including any attached peripherals, and disconnect the system from the electrical
outlet.
2 Open the system. See "Opening the System" on page 54.
3 Remove the memory cooling shroud. See "Removing the Cooling Shroud" on page 67.
Table 3-2. Memory Sparing Configurations
DIMMs Size/Type Total Memory Available Spare
8 256-MB single-rank 2 GB 1 GB 1 GB
512-MB single-rank 4 GB 2 GB 2 GB
1-GB single-rank 8 GB 4 GB 4 GB
2-GB single-rank 16 GB 8 GB 8 GB
2-GB dual-rank 16 GB 12 GB 4 GB
4-GB dual-rank 32 GB 24 GB 8 GB
Book.book Page 90 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g