Dell PowerEdge 2950 User Manual

Installing System Components 53
The system board holds the system's control circuitry and other electronic components. Several hardware
options, such as the microprocessors and memory, are installed directly on the system board. The expansion-
card cage containing the left riser accommodates up to two full-length PCIe or PCI-X expansion cards, while
the central riser accommodates one half-length PCIe expansion card.
The system provides space for an optional optical drive. The optical drive connects to the controllers on the
system board through the sideplane board. For more information, see "Optical Drive" on page 81.
Depending on the hard drive configuration you ordered, an optional 3.5-inch diskette drive, and an
optional tape drive may also be available for installation into a media bay. See Table 3-1 for configuration
options.
Table 3-1. Hard Drive and Media Bay Configurations
The hard-drive bays provide space for up to eight 2.5-inch SAS drives or six 3.5-inch SAS or SATA hard
drives. The hard drives connect to a RAID controller card through the SAS backplane board. For more
information, see "Hard Drives" on page 55 and "SAS Controller Daughter Card" on page 69.
During an installation or troubleshooting procedure, you may be required to change a jumper setting. For
more information, see "System Board Jumpers" on page 135.
Front Bezel
A lock on the bezel restricts access to the power button, diskette drive, optical drive, and hard drive(s). A
control panel LCD located on the front panel and accessible through the front bezel displays the system’s
status.
Removing the Front Bezel
1 Using the system key, unlock the bezel.
2 Press the tab at the left end of the bezel.
3 Rotate the left end of the bezel away from the system to release the right end of the bezel.
4 Pull the bezel away from the system. See Figure 3-2.
Number of Hard Drives on Backplane Hard-Drive Size Media Bay
63.5-inchNo
4 3.5-inch Yes
8 2.5-inch Yes
Book.book Page 53 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g