Dell PowerEdge 2950 User Manual

Installing System Components 95
Figure 3-29. Installing and Removing a Processor
13 Lift the processor out of the socket and leave the release lever up so that the socket is ready for the new
processor.
NOTICE: Be careful not to bend any of the pins on the ZIF socket when removing the processor. Bending the pins
can permanently damage the system board.
Installing a Processor
1 Unpack the new processor.
2 Align the p rocessor with the socket keys on t he ZIF socket. See Figure 3-29.
3 I nstall the processor in the socket.
NOTICE: Positioning the processor incorrectly can permanently damage the system board or the processor when
you turn it on. When placing the processor in the socket, be careful not to bend the pins in the socket.
a
If the release lever on the processor socket is not positioned all the way up, move it to that
position.
b With the p rocessor and the socket keys aligned, set the processor lightly in the socket.
NOTICE: Do not use force to seat the processor. When the processor is positioned correctly, it engages easily into
the socket.
c
Close the processor shield. See Figure 3-29.
d W hen the processor is fully seated in the socket, rotate the socket release lever back down until
it snaps into place, securing the processor.
See Figure 3-29.
1 notch in processor (2) 2 processor 3 socket-release lever
4 processor shield 5 ZIF socket 6 socket key (2)
3
6
4
5
1
2
Book.book Page 95 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g