Dell PowerEdge 2950 User Manual

Installing System Components 107
4 Connect the display module cable to the control panel board. See Figure 3-35.
5 Connect the control panel cable to the control panel board. See Figure 3-35.
6 Close the system. See "Closing the System" on page 55.
7 Reconnect the system to the power source and turn on the system and attached peripherals.
8 If applicable, install the bezel.
System Board (Service-only Procedure)
Removing the System Board
CAUTION: Only trained service technicians are authorized to remove the system cover and access any of the
components inside the system. See your Product Information Guide for complete information about safety
precautions, working inside the computer, and protecting against electrostatic discharge.
1 Turn off the system and attached peripherals, and disconnect the system from the electrical outlet.
2 Open the system. See"Opening the System" on page 54
3 If applicable, remove any expansion cards. See "Installing an Expansion Card" on page 77
4 Remove the expansion-card cage. See "Removing the Expansion-Card Cage" on page 78
5 Remove the cooling shroud. See "Removing the Cooling Shroud" on page 67.
6 Remove the fans. See "Removing a System Fan" on page 65.
7 Remove the fan bracket. See "Removing the Fan Bracket" on page 68
8 If applicable, remove the RAC card. See "Installing a RAC Card" on page 80
CAUTION: The DIMMs are hot to the touch for some time after the system has been powered down. Allow time
for the DIMMs to cool before handling them. Handle the DIMMs by the card edges and avoid touching the DIMM
components.
9 Remove the memory modules. See "Removing Memory Modules" on page 92.
NOTE: While removing the memory modules, record the memory module socket locations to ensure proper
installation.
10 Remove the heatsink(s) and microprocessor(s). See "Removing a Processor" on page 93.
11 Remove the TOE key, if present. See Figure 6-2 for the location of the TOE key.
12 Remove the sideplane. See "Removing the Sideplane Board" on page 101.
13 Remove the SAS backplane. See "Removing the SAS Backplane Board" on page 103.
14 Remove the system board:
a Pull the system-board tray riser release pin. See Figure 3-36.
b While pulling the release pin, slide the system-board tray toward the front of the chassis.
c Lift up the system-board tray and remove it from the chassis.
Book.book Page 107 Friday, February 3, 2006 11:09 AM

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g