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Dell PowerEdge 2950 User Manual

Dell PowerEdge 2950
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Installing System Components 91
NOTICE: Never remove the memory cooling shroud without first powering down the system. Overheating of the
system can develop quickly resulting in a shutdown of the system and the loss of data.
4
Locate the memory module sockets on the system board. See Figure 6-2.
CAUTION: The DIMMs are hot to the touch for some time after the system has been powered down. Allow time
for the DIMMs to cool before handling them. Handle the DIMMs by the card edges and avoid touching the DIMM
components.
5
Press the ejectors on the memory module socket down and out, as shown in Figure 3-27, to allow the
memory module to be inserted into the socket.
Figure 3-27. Installing and Removing a Memory Module
6
Align the memory module's edge connector with the alignment key on the memory module socket, and
insert the memory module in the socket.
NOTE: The memory module socket has an alignment key that allows you to install the memory module in the
socket in only one way.
7
Press down on the memory module with your thumbs while pulling up on the ejectors with your index
fingers to lock the memory module into the socket.
When the memory module is properly seated in the socket, the ejectors on the memory module socket
align with the ejectors on the other sockets that have memory modules installed.
8
Repeat step 3 through step 7 of this procedure to install the remaining memory modules.
1 memory module 2 memory module socket
ejectors (2)
3 socket
4 alignment key
2
1
3
4
Book.book Page 91 Friday, February 3, 2006 11:09 AM

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Dell PowerEdge 2950 Specifications

General IconGeneral
Tcase67 °C
Bus typeFSB
SteppingE0
FSB ParityYes
Processor codeSLBBP
Processor cache12 MB
Processor cores4
Processor modelE5405
System bus rate- GT/s
Processor seriesIntel Xeon 5400 Series
Processor socketLGA 771 (Socket J)
Processor codenameHarpertown
Motherboard chipsetIntel® 5000X
Processing Die size214 mm²
Processor frequency2 GHz
Processor cache typeL2
Processor lithography45 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus1333 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)6
Number of Processing Die Transistors820 M
HDD size3.5 \
HDD capacity160 GB
HDD interfaceSerial ATA
Total storage capacity3320 GB
Maximum storage capacity6 TB
Graphics cardES1000
Memory slots8x DIMM
Internal memory4 GB
Memory clock speed667 MHz
Internal memory typeDDR2-SDRAM
Maximum internal memory64 GB
Memory layout (slots x size)2 x 2 GB
Maximum graphics card memory16 MB
Networking featuresBroadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocolsTOE (TCP/IP)
Other network protocols supportediSCSI Boot
PS/2 ports quantity0
USB 2.0 ports quantity5
Bundled softwareSymantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systemsMicrosoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis typeRack (2U)
Storage temperature (T-T)-40 - 65 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)-40 - 65 %
Operating relative humidity (H-H)20 - 80 %
CertificationFCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID33079
Weight and Dimensions IconWeight and Dimensions
Depth744 mm
Width444.3 mm
Height86.4 mm
Weight23000 g

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