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Dell PowerEdge 2950 User Manual

Dell PowerEdge 2950
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Installing System Components 87
4
Prepare the tape drive for installation.
Ground yourself by touching an unpainted metal surface on the back of the system, unpack the drive
(and controller card, if applicable), and compare the jumper and switch settings with those in the drive
documentation.
5
Aligning the four holes on the tape drive with the four screw holes on the tape drive rails, affix the rails
to the drive.
6
Insert the tape drive along the rails in the media bay. See Figure 3-25.
Figure 3-25. Removing and Installing an Internal SCSI Tape Drive
7
Route the tape drive's SCSI interface cable through the tape drive cable retention bracket and connect
it to the connector on the SCSI controller card. See "Removing and Replacing the Tape Drive Cable
Retention Bracket" on page 88.
8
Connect the tape drive power cable to the tape drive power connector on the backplane. See Figure 6-4
or Figure 6-5 for the connector location.
9
Reconnect the system to its electrical outlet and turn the system on, including any attached
peripherals.
10
Perform a tape backup and verification test with the drive as instructed in the software documentation
that came with the drive.
1 screws (4) 2 tape drive rails (2) 3 rail release tabs (2)
4 tape drive
1
2
4
3
Book.book Page 87 Friday, February 3, 2006 11:09 AM

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Dell PowerEdge 2950 Specifications

General IconGeneral
Tcase67 °C
Bus typeFSB
SteppingE0
FSB ParityYes
Processor codeSLBBP
Processor cache12 MB
Processor cores4
Processor modelE5405
System bus rate- GT/s
Processor seriesIntel Xeon 5400 Series
Processor socketLGA 771 (Socket J)
Processor codenameHarpertown
Motherboard chipsetIntel® 5000X
Processing Die size214 mm²
Processor frequency2 GHz
Processor cache typeL2
Processor lithography45 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus1333 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)6
Number of Processing Die Transistors820 M
HDD size3.5 \
HDD capacity160 GB
HDD interfaceSerial ATA
Total storage capacity3320 GB
Maximum storage capacity6 TB
Graphics cardES1000
Memory slots8x DIMM
Internal memory4 GB
Memory clock speed667 MHz
Internal memory typeDDR2-SDRAM
Maximum internal memory64 GB
Memory layout (slots x size)2 x 2 GB
Maximum graphics card memory16 MB
Networking featuresBroadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocolsTOE (TCP/IP)
Other network protocols supportediSCSI Boot
PS/2 ports quantity0
USB 2.0 ports quantity5
Bundled softwareSymantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systemsMicrosoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis typeRack (2U)
Storage temperature (T-T)-40 - 65 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)-40 - 65 %
Operating relative humidity (H-H)20 - 80 %
CertificationFCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID33079
Weight and Dimensions IconWeight and Dimensions
Depth744 mm
Width444.3 mm
Height86.4 mm
Weight23000 g

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