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Dell POWEREDGE R710 User Manual

Dell POWEREDGE R710
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Installing System Components 137
3
Remove the cooling shroud. See "Removing the Cooling Shroud."
4
Locate the memory module sockets. See Figure 6-2.
5 Press down and out on the ejectors on each end of the socket until the
memory module pops out of the socket.
See Figure 3-30.
CAUTION: Handle each memory module only by the card edges, ensuring not to
touch the components on the module.
6
Reinstall the cooling shroud.
7
Close the system. See "Closing the System."
8
Reconnect your system and peripherals to their electrical outlets, and turn
on the system.
Processors
Removing a Processor
CAUTION: Many repairs may only be done by a certified service technician. You
should only perform troubleshooting and simple repairs as authorized in your
product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered
by your warranty. Read and follow the safety instructions that came with the
product.
1
Prior to upgrading your system,
download the latest system BIOS version
from support.dell.com and follow the instructions included in the
compressed download file to install the update on your system
.
2
Turn off the system, including any attached peripherals, and disconnect
the system from the electrical outlet.
3
Open the system. See "Opening the System."
4
Remove the cooling shroud. See "Removing the Cooling Shroud."
WARNING: The heat sink and processor are hot to the touch for some time after
the system has been powered down. Allow the heat sink and processor to cool
before handling them.
CAUTION: Never remove the heat sink from a processor unless you intend to
remove the processor. The heat sink is necessary to maintain proper thermal
conditions.
5
Release one of the heat-sink release levers. See Figure 3-31.

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Dell POWEREDGE R710 Specifications

General IconGeneral
Tcase76 °C
Bus typeQPI
SteppingD0
FSB ParityNo
Processor codeSLBF7
Processor cache8 MB
Processor cores4
Processor modelE5530
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5500 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameNehalem EP
Motherboard chipsetIntel® 5520
Number of QPI links2
Processing Die size263 mm²
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography45 nm
Processor system typeDP
Processor manufacturerIntel
Processor package size42.5 x 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)18
Memory types supported by processorDDR3-SDRAM
Number of Processing Die Transistors731 M
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor144 GB
HDD size3.5 \
HDD capacity146 GB
HDD interfaceSerial Attached SCSI (SAS)
Optical drive typeDVD-ROM
Total storage capacity292 GB
Maximum storage capacity6 TB
Internal memory12 GB
Memory clock speed1066 MHz
Memory layout (slots x size)6 x 2 GB
Graphics cardG200
Dimensions (WxDxH)443.1 x 680.7 x 86.4 mm
Non-operating relative humidity (non-condensing)5 - 95 %
PS/2 ports quantity0
USB 2.0 ports quantity5
Power supply570 W
Power requirements90 - 264V
Compatible operating systemsWindows Server, Standart Business Server, Novell SUSE Linux, Red Hat Linux Enterprise
Chassis typeRack (2U)
Storage temperature (T-T)-40 - 65 °C
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)20 - 80 %
Networking featuresGigabit Ethernet
Processor ARK ID37103
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth680.7 mm
Width443.1 mm
Height86.4 mm
Weight26100 g

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