HP Compaq 6000 Pro User Manual

Electrostatic Discharge Information
A sudden discharge of static electricity from your finger or other conductor can destroy static-sensitive
devices or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic
device exposed to electrostatic discharge (ESD) may not appear to be affected at all and can work
perfectly throughout a normal cycle. The device may function normally for a while, but it has been
degraded in the internal layers, reducing its life expectancy.
Networks built into many integrated circuits provide some protection, but in many cases, the discharge
contains enough power to alter device parameters or melt silicon junctions.
Generating Static
The following table shows that:
●
Different activities generate different amounts of static electricity.
●
Static electricity increases as humidity decreases.
Relative Humidity
Event 55% 40% 10%
Walking across carpet
Walking across vinyl floor
Motions of bench worker
Removing DIPs* from plastic tube
7,500 V
3,000 V
400 V
400 V
15,000 V
5,000 V
800 V
700 V
35,000 V
12,000 V
6,000 V
2,000 V
Removing DIPs* from vinyl tray
Removing DIPs* from Styrofoam
Removing bubble pack from PCB
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
*These are then multi-packaged inside plastic tubes, trays, or Styrofoam.
NOTE: 700 volts can degrade a product.
Preventing Electrostatic Damage to Equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree
of sensitivity. The following packaging and grounding precautions are necessary to prevent damage to
electric components and accessories.
●
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
●
Protect all electrostatic parts and assemblies with conductive or approved containers or
packaging.
26 Chapter 5 Identifying the Chassis, Routine Care, and Disassembly Preparation

HP Compaq 6000 Pro Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	C0
Processor cache	6 MB
Processor cores	2
Processor model	E8500
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3.16 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Processor core voltage (AC)	0.850/1.3625 V
Number of processors installed	1
CPU multiplier (bus/core ratio)	9.5
Number of Processing Die Transistors	410 M
Platform	PC
LightScribe	Yes
Power supply type	AC/DC
Security features	TPM 1.2
External drive bays	2 x 5.25\
Internal drive bays	2 x 3.5\
Networking features	Gigabit Ethernet
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Audio system	Realtek ALC261
Motherboard chipset	Intel® Q43
Audio output channels	2.0 channels
Memory slots	4x DIMM
Internal memory	4 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD-RW
Total storage capacity	500 GB
Discrete graphics card model	Not available
On-board graphics card model	Intel® GMA 4500
On-board graphics card family	Intel® GMA
Operating system installed	Windows 7 Professional
USB 2.0 ports quantity	10
Firewire (IEEE 1394) ports	0
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Cable lock slot type	Kensington
Number of 3.5\" bays	3
Power supply	320 W
Processor code	SLAPK
Processor ARK ID	33911
Processor package size	37.5 x 37.5 mm

Weight and Dimensions

Depth	430 mm
Width	176 mm
Height	377 mm
Weight	9300 g