HP FlexNetwork 5140 EI Series User Manual

3
Cleanliness
Dust buildup on the chassis might cause electrostatic adsorption and dust corrosion, resulting in
poor contact of metal connectors and contact points. This might shorten the device's lifetime and
even cause device failure in the worst case. Table 2 describes the dust concentration limits in the
equipment room.
Table 2 Dust concentration limits in the equipment room
Substance
Particle diameter
Concentration limit
Dust particles ≥ 0.5 µm ≤ 3.5 × 106 particles/m3
Dust particles ≥ 5 µm ≤ 3 × 104 particles/m3
Dust (suspension) ≤ 75 µm ≤ 0.4 mg/m3
Dust (sedimentation) 75 µm to 150 µm ≤ 15 mg/(m2h)
Sand ≥ 150 µm ≤ 300 mg/m3
To maintain cleanliness in the equipment room, follow these guidelines:
•
Keep the equipment room away from pollution sources. Do not smoke, eat, or drink in the
equipment room.
•
Use double-layer glass in windows and seal doors and windows with dust-proof rubber strips.
Use screen doors and window screens for doors and windows open to the outside and make
sure the external windows are air tight.
•
Use dustproof materials for floors, walls, and ceilings and use wallpaper or matt paint that does
not produce powders.
•
Clean the equipment room regularly and clean the air filters of the rack each month.
•
Wear ESD clothing and shoe covers before entering the equipment room, keep the ESD
clothing and shoe covers clean, and change them frequently.
Corrosive gas limit
Corrosive gases can accelerate corrosion and aging of metal components. Make sure the corrosive
gases in the equipment room do not exceed the concentration limits as shown in Table 3.
Table 3 Corrosive gas concentration limits in the equipment room
Gas
Average concentration (mg/m3)
Maximum concentration (mg/m3)
SO
2
0.3 1.0
H
2
S 0.1 0.5
Cl
2
0.1 0.3
HCI 0.1 0.5
HF 0.01 0.03
NH
3
1.0 3.0
O
3
0.05 0.1
NO
X
0.5 1.0

HP FlexNetwork 5140 EI Series Specifications

General

Brand	HP
Model	FlexNetwork 5140 EI Series
Category	Switch
Language	English