HP Z230 User Manual

Workstation specifications
SFF
Processor
technology
Intel Series C226 chipset:
●
Support for the Intel® Xeon® Processor E3 v3 Family, third-generation Intel Core™ processors
up to 95 W, or Intel Pentium® processors
●
Integrated 2-channel memory controller
●
Microarchitecture improvements
●
Integrated graphics (some models)
●
Advanced Vector Extensions (AVX) to increase floating point performance
●
Intel DMI2 interface connecting the processor to the I/O controller
Power supply
●
240 W, 92% efficient, compatible with ENERGY STAR® Version 5.2 requirements
●
240 W, STD efficient
●
Supports European Union ERP Lot 6 tier 2 power limit of less than 0.5W in off mode
Memory
technology
●
Dual in-line memory modules (DIMMs) based on DDR3 1600 MHz technology
●
Supports error checking and correcting (ECC) and non-ECC DIMMs
●
Two direct-attach memory channels enable low-latency access and fast data transfer for
improved performance
●
Up to 32 GB system memory (8 GB DIMMs)
●
1600 MHz 2, 4, 8 GB ECC unbuffered DIMM
●
1600 MHz 2, 4, 8 GB non ECC unbuffered DIMM
Graphics cards
Supports:
●
PCIe Gen3 (PCIe3) bus speeds; can support dual PCIe Gen2 graphics cards in mechanical
PCIe x16 slots
●
Multiple graphics cards, provided their total power usage is within 45 W
●
Up to two displays with integrated Intel HD graphics (depending on processor type)
●
Up to six 2D displays or four 3D displays
NOTE: Most supported Intel Core processors provide Intel HD Graphics 4400/4600; Intel Xeon
processors with model designations that end in "---5" provide Intel HD Graphics P4600.
NOTE: To drive more than three displays, use Computer Setup (f10) Utility to intermix integrated
Intel HD graphics and discrete graphics cards (with three or more displays, HP recommends using
only discrete graphics cards).
I/O technology
●
RAID configurations for SATA RAID levels 0, 1
●
Supports eSATA (3.0 Gbps) using an optional adapter
●
Six external and two internal USB 2.0 ports
●
Four external USB 3.0 ports and one internal USB 3.0 port
●
Parallel and serial headers that can be used with an optional PCI bulkhead connector
Small form factor workstation components 9

HP Z230 Specifications

General

Product type	Workstation
Motherboard chipset	Intel® C226
ECC	Yes
Memory slots	4x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	1 x 4 GB
Chassis type	Desktop
Product color	Black
Country of origin	China
Placement supported	Vertical
Number of 3.5\" bays	1
Water cooling system	No
HDD speed	7200 RPM
RAID levels	0, 1
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
PS/2 ports quantity	2
DisplayPorts quantity	3
Serial ports quantity	-
USB 2.0 ports quantity	6
VGA (D-Sub) ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	4
Ethernet LAN data rates	10, 100, 1000 Mbit/s
On-board graphics card ID	0x412
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4600
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1150 MHz
Power supply	240 W
Tcase	72.72 °C
Bus type	DMI2
Stepping	C0
Processor cache	6 MB
Processor model	i5-4570
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	28 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	84 W
Maximum number of PCI Express lanes	16
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Operating system installed	Windows 7 Professional
Scalability	1S
Processor code	SR14E
Processor ARK ID	75043
Intel TSX-NI version	0.00
Processor package size	37.5 x 37.5 mm
Graphics & IMC lithography	22 nm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2013D
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	384 mm
Width	337 mm
Height	100 mm
Weight	7200 g